Imaging based engine with multiple elements supported on a common printed circuit board

ABSTRACT

An apparatus for use in decoding a bar code symbol may include an image sensor integrated circuit having a plurality of pixels, timing, and control circuitry for controlling an image sensor, gain circuitry for controlling gain, and analog to digital conversion circuitry for conversion of an analog signal to a digital signal. The apparatus may also include a printed circuit board for receiving the image sensor integrated circuit. The connection between the image sensor integrated circuit and the printed circuit board characterized by a plurality of conductive adhesive connectors disposed between a plurality of electrode pads and a plurality of contact pads, where the conductive adhesive connectors provide electrical input/output and mechanical connections between the image sensor integrated circuit and the printed circuit board. The apparatus may be operative for processing image signals generated by the image sensor integrated circuit for attempting to decode the bar code symbol.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. patent applicationSer. No. 14/342,544 for an Imaging Based Barcode Scanner Engine withMultiple Elements Supported on a Common Printed Circuit Board filed Aug.19, 2014 (and published Nov. 27, 2014 as U.S. Patent ApplicationPublication No. 2014/0346233), now U.S. Pat. No. 9,111,159, which claimsthe benefit of International Application No. PCT/CN2011/001531 for anImaging Based Barcode Scanner Engine with Multiple Elements Supported ona Common Printed Circuit Board filed Sep. 9, 2011 (and published Mar.14, 2013 as International Publication No. WO 2013/033867). Each of theforegoing patent applications, patent publications, and patent is herebyincorporated by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates, in general, to decoding of bar codesymbols, and is particularly related to an apparatus for use in decodinga bar code symbol with multiple elements supported on a common printedcircuit board.

BACKGROUND

Indicia reading terminals for reading decodable indicia are available inmultiple varieties. For example, minimally featured indicia readingterminals devoid of a keyboard and display are common in point of saleapplications. Indicia reading terminals devoid of a keyboard and displayare available in the recognizable gun style form factor having a handleand trigger button (trigger) that can be actuated by an index finger.Indicia reading terminals having keyboards and displays are alsoavailable. Keyboard and display equipped indicia reading terminals arecommonly used in shipping and warehouse applications, and are availablein form factors incorporating a display and keyboard. In a keyboard anddisplay equipped indicia reading terminal, a trigger button foractuating the output of decoded messages is typically provided in suchlocations as to enable actuation by a thumb of an operator. Indiciareading terminals in a form devoid of a keyboard and display or in akeyboard and display equipped form are commonly used in a variety ofdata collection applications including point of sale applications,shipping applications, warehousing applications, security check pointapplications, and patient care applications, and personal use, commonwhere keyboard and display equipped indicia reading terminal is providedby a personal mobile telephone having indicia reading functionality.Some indicia reading terminals are adapted to read bar code symbolsincluding one or more of one dimensional (1D) bar codes, stacked 1D barcodes, and two dimensional (2D) bar codes. Other indicia readingterminals are adapted to read OCR characters while still other indiciareading terminals are equipped to read both bar code symbols and OCRcharacters.

BRIEF DESCRIPTION OF THE DRAWINGS

The features described herein can be better understood with reference tothe drawings described below. The drawings are not necessarily to scale,emphasis instead generally being placed upon illustrating the principlesof the invention. In the drawings, like numerals are used to indicatelike parts throughout the various views.

FIG. 1 is a block diagram of an apparatus for use in decoding a bar codesymbol, the apparatus having multiple elements supported on a commonprinted circuit board, in accordance with an aspect of the invention;

FIG. 2 is an exploded assembly perspective view of an imaging module, inaccordance with an aspect of the invention;

FIG. 3 is a perspective view of an imaging module, in accordance with anaspect of the invention;

FIG. 4 is a side view of an apparatus for use in decoding a bar codesymbol, in accordance with an aspect of the invention;

FIG. 5 is a side view of an apparatus for use in decoding a bar codesymbol, in accordance with an aspect of the invention; and

FIG. 6 is a perspective view of an apparatus for use in decoding a barcode symbol, in accordance with an aspect of the invention.

SUMMARY

According to one aspect, an invention for use in decoding a bar codesymbol is provided. The apparatus may include an image sensor integratedcircuit having a plurality of pixels arranged in a plurality of rows andcolumns of pixels, timing and control circuitry for controlling an imagesensor, gain circuitry for controlling the gain of one or more signals,analog to digital conversion circuitry for conversion of an analogsignal to a digital signal, and a plurality of electrode pads on asurface of the image sensor integrated circuit. The apparatus may alsoinclude a printed circuit board for receiving the image sensorintegrated circuit and a plurality of contact pads disposed on a surfaceof the printed circuit board. The connection between the image sensorintegrated circuit and the printed circuit board may be characterized bya plurality of conductive adhesive connectors disposed between theplurality of electrode pads on the surface of the image sensorintegrated circuit and the plurality of contact pads disposed on thesurface of the printed circuit board, where the conductive adhesiveconnectors provide electrical input/output and mechanical connectionsbetween the image sensor integrated circuit and the printed circuitboard. The apparatus may be operative for processing image signalsgenerated by the image sensor integrated circuit for attempting todecode the bar code symbol.

According to alternative aspects, the apparatus may further comprise ahand held housing encapsulating the image sensor integrated circuit. Inanother aspect, the apparatus may further comprise a light source bankpositioned on the printed circuit board. In one aspect, the light sourcebank may be an LED. In a further aspect, the light source bank may beelectrically connected to the printed circuit board. In another aspect,the apparatus may include an aimer light source bank positioned on theprinted circuit board. The aimer light source bank may be an LED. Theapparatus may include an aimer subsystem electrically connected to theprinted circuit board. In another aspect, the processing of imagesignals generated by the image sensor integrated circuit for attemptingto decode the bar code symbol may be performed by a circuit disposed onthe printed circuit board. In an alternative aspect, the processing ofimage signals generated by the image sensor integrated circuit forattempting to decode the bar code symbol may be performed by a computerexternal to the housing. In another aspect, the processing of imagesignals generated by the image sensor integrated circuit for attemptingto decode the bar code symbol may be performed within the housing. Inanother aspect, the processing of the image signal generated by theimage sensor integrated circuit for attempting to decode the bar codesymbol is performed by circuitry external to the housing.

DETAILED DESCRIPTION

In traditional applications, barcode engines and other scanning deviceshave typically been disposed on multiple Printed Circuit Boards (PCBs).Multiple PCBs have been required because image based barcode scannersrequired a large number of component parts, including, but not limitedto, an image sensor, a lens assembly, an illumination light source, anaimer light source, and/or a microcontroller some of which were largeand/or bulky. Where additional PCBs are used, the costs and the risk ofproduct failure due to potential connection problems between PCBsincrease.

According to the present invention, more than one of the required partsfor an imaging based barcode scanner engine may be disposed on a commonPCB. The placement of component parts on a common PCB reduces theoverall cost and risk of failure of the imaging based barcode scannerengine. In various embodiments, an image sensor integrated circuitincluding, for example, a camera module, an illumination light source,and/or an aimer light source may all be disposed on a single PCB. Ifdesired, additional elements may be placed on a common PCB.

An exemplary hardware platform for support of operations describedherein with reference to an apparatus 1000 for use in decoding a barcode symbol is shown and described with reference to FIG. 1.

Bar code decoding apparatus 1000 may include a housing 1014. Apparatus1000 can include an image sensor 1032 comprising a multiple pixel imagesensor array 1033 having pixels arranged in rows and columns of pixels,associated column circuitry 1034 and row circuitry 1035. Associated withthe image sensor 1032 can be amplifier or gain circuitry 1036(amplifier), and an analog to digital converter 1037 which convertsimage information in the form of analog signals read out of image sensorarray 1033 into image information in the form of digital signals. Imagesensor 1032 can also have an associated timing and control circuit 1038for use in controlling e.g., the exposure period of image sensor 1032,gain applied to the amplifier 1036. The noted circuit components 1032,1036, 1037, and 1038 can be packaged into a common image sensorintegrated circuit 1040. Image sensor integrated circuit 1040 canincorporate fewer than the noted number of components. In one example,image sensor array 1033 can be a hybrid monochrome and color imagesensor array having a first subset of monochrome pixels without colorfilter elements and a second subset of color pixels having colorsensitive filter elements. In one example, image sensor integratedcircuit 1040 can incorporate a Bayer pattern filter, so that defined atthe image sensor array 1033 are red pixels at red pixel positions, greenpixels at green pixel positions, and blue pixels at blue pixelpositions. Frames that are provided utilizing such an image sensor arrayincorporating a Bayer pattern can include red pixel values at red pixelpositions, green pixel values at green pixel positions, and blue pixelvalues at blue pixel positions. In an embodiment incorporating a Bayerpattern image sensor array, CPU 1060 prior to subjecting a frame tofurther processing can interpolate pixel values at frame pixel positionsintermediate of green pixel positions utilizing green pixel values fordevelopment of a monochrome frame of image data. Alternatively, CPU 1060prior to subjecting a frame for further processing can interpolate pixelvalues intermediate of red pixel positions utilizing red pixel valuesfor development of a monochrome frame of image data. CPU 1060 canalternatively, prior to subjecting a frame for further processinginterpolate pixel values intermediate of blue pixel positions utilizingblue pixel values. An imaging subsystem of apparatus 1000 can includeimage sensor 1032 and a lens assembly 200 for focusing an image ontoimage sensor array 1033 of image sensor 1032.

In the course of operation of apparatus 1000, image signals can be readout of image sensor 1032, converted, and stored into a system memorysuch as RAM 1080. A memory 1085 of apparatus 1000 can include RAM 1080,a nonvolatile memory such as EPROM 1082 and a storage memory device 1084such as may be provided by a flash memory or a hard drive memory. In oneembodiment, apparatus 1000 can include CPU 1060 which can be adapted toread out image data stored in memory 1080 and subject such image data tovarious image processing algorithms. Apparatus 1000 can include a directmemory access unit (DMA) 1070 for routing image information read outfrom image sensor 1032 that has been subject to conversion to RAM 1080.In another embodiment, apparatus 1000 can employ a system bus providingfor bus arbitration mechanism (e.g., a PCI bus) thus eliminating theneed for a central DMA controller. A skilled artisan would appreciatethat other embodiments of the system bus architecture and/or directmemory access components providing for efficient data transfer betweenthe image sensor 1032 and RAM 1080 are within the scope and the spiritof the invention.

Referring to further aspects of apparatus 1000, imaging lens assembly200 can be adapted for focusing an image of a decodable indicia 15located within a field of view 1240 on a substrate, T, onto image sensorarray 1033. A size in target space of a field of view 1240 of apparatus1000 can be varied in a number of alternative ways. A size in targetspace of a field of view 1240 can be varied, e.g., by changing aterminal to target distance, changing an imaging lens assembly setting,changing a number of pixels of image sensor array 1033 that are subjectto read out. Imaging light rays can be transmitted about imaging axis25. Lens assembly 200 can be adapted to be capable of multiple focallengths and multiple planes of optimum focus (best focus distances).

Apparatus 1000 can include an illumination subsystem 800 forillumination of target, T, and projection of an illumination pattern1260. Illumination pattern 1260, in the embodiment shown can beprojected to be proximate to but larger than an area defined by field ofview 1240, but can also be projected in an area smaller than an areadefined by a field of view 1240. Illumination subsystem 800 can includea light source bank 500, comprising one or more light sources. Theapparatus 100 may be configured so that the light from light source bank500 is directed toward a field of view 1240. Thus in variousembodiments, light source bank 500 may be configured such that isaffixed to the apparatus 1000, while in other embodiments light sourcebank 500 may be remote and direct light toward apparatus 1000 or fieldof view 1240.

A physical form view of an example of an illumination subsystem is shownin FIGS. 2-3. As shown in FIGS. 2-3, an imaging module 400 can beprovided having a circuit board 402 carrying image sensor 1032 and lensassembly 200 disposed in support 430 disposed on circuit board 402. Inthe embodiment of FIGS. 2 and 3, illumination subsystem 800 has a lightsource bank 500 provided by single light source 502. Single light source502 may be, for example purposes, an LED. In another embodiment, lightsource bank 500 can be provided by more than one light source 502 forexample, more than one LED. Apparatus 1000 can be adapted so that lightfrom each of a one or more light source 502 of light source bank 500 isdirected toward field of view 1240 and utilized for projection ofillumination pattern 1240. Referring again to FIG. 1, apparatus 1000 canalso include an aiming subsystem 600 for projecting an aiming pattern1242. Aiming subsystem 600 which can comprise a light source bank can becoupled to aiming light source bank power input unit 1208 for providingelectrical power to a light source bank of aiming subsystem 600. Theaiming light source bank may be, for example, one or more light source602. Apparatus 1000 can be adapted so that light from one or more lightsource of aiming light source 600 is directed toward field of view 1240and is utilized for projection of aiming pattern 1242. Power input unit1208 can be coupled to system bus 1500 via interface 1108 forcommunication with CPU 1060.

In one embodiment, illumination subsystem 800 can include, in additionto light source bank 500, an illumination lens assembly 300, as is shownin the embodiment of FIG. 1. In addition to or in place of illuminationlens assembly 300 illumination subsystem 800 can include alternativelight shaping optics, e.g. one or more diffusers, mirrors and prisms. Inuse, apparatus 1000 can be oriented by an operator with respect to atarget, T, (e.g., a piece of paper, a package, another type ofsubstrate) bearing decodable indicia 15 in such manner that illuminationpattern 1260 is projected on a decodable indicia 15. In the example ofFIG. 1, decodable indicia 15 is provided by a 1D bar code symbol.Decodable indicia 15 could also be provided by a 2D bar code symbol oroptical character recognition (OCR) characters. Referring to furtheraspects of apparatus 1000, lens assembly 200 can be controlled with useof electrical power input unit 1202 which provides energy for changing aplane of optimum focus of lens assembly 200. In one embodiment, anelectrical power input unit 1202 can operate as a controlled voltagesource, and in another embodiment, as a controlled current source.Electrical power input unit 1202 can apply signals for changing opticalcharacteristics of lens assembly 200, e.g., for changing a focal lengthand/or a best focus distance of (a plane of optimum focus of) lensassembly 200. Light source bank electrical power input unit 1206 canprovide energy to light source bank 500. In one embodiment, electricalpower input unit 1206 can operate as a controlled voltage source. Inanother embodiment, electrical power input unit 1206 can operate as acontrolled current source. In another embodiment electrical power inputunit 1206 can operate as a combined controlled voltage and controlledcurrent source. Electrical power input unit 1206 can change a level ofelectrical power provided to (energization level of) light source bank500, e.g., for changing a level of illumination output by light sourcebank 500 of illumination subsystem 800 for generating illuminationpattern 1260.

In another aspect, apparatus 1000 can include power supply 1402 thatsupplies power to a power grid 1404 to which electrical components ofapparatus 1000 can be connected. Power supply 1402 can be coupled tovarious power sources, e.g., a battery 1406, a serial interface 1408(e.g., USB, RS232), and/or AC/DC transformer 1410).

Further regarding power input unit 1206, power input unit 1206 caninclude a charging capacitor that is continually charged by power supply1402. Power input unit 1206 can be configured to output energy within arange of energization levels. An average energization level ofillumination subsystem 800 during exposure periods with the firstillumination and exposure control configuration active can be higherthan an average energization level of illumination and exposure controlconfiguration active.

Apparatus 1000 can also include a number of peripheral devices includingtrigger 1220 which may be used to make active a trigger signal foractivating frame readout and/or certain decoding processes. Apparatus1000 can be adapted so that activation of trigger 1220 activates atrigger signal and initiates a decode attempt. Specifically, apparatus1000 can be operative so that in response to activation of a triggersignal, a succession of frames can be captured by way of read out ofimage information from image sensor array 1033 (typically in the form ofanalog signals) and then storage of the image information afterconversion into memory 1080 (which can buffer one or more of thesuccession of frames at a given time). CPU 1060 can be operative tosubject one or more of the succession of frames to a decode attempt.

For attempting to decode a bar code symbol, e.g., a one dimensional barcode symbol, CPU 1060 can process image data of a frame corresponding toa line of pixel positions (e.g., a row, a column, or a diagonal set ofpixel positions) to determine a spatial pattern of dark and light cellsand can convert each light and dark cell pattern determined into acharacter or character string via table lookup. Where a decodableindicia representation is a 2D bar code symbology, a decode attempt cancomprise the steps of locating a finder pattern using a featuredetection algorithm, locating matrix lines intersecting the finderpattern according to a predetermined relationship with the finderpattern, determining a pattern of dark and light cells along the matrixlines, and converting each light pattern into a character or characterstring via table lookup. CPU 1060, which, as noted, can be operative inperforming processing for attempting to decode decodable indicia, can beincorporated in an integrated circuit 2060 disposed on circuit board 402(shown in FIGS. 2 and 3).

Apparatus 1000 can include various interface circuits for couplingvarious of the peripheral devices to system address/data bus (systembus) 1500, for communication with CPU 1060 also coupled to system bus1500. Apparatus 1000 can include interface circuit 1028 for couplingimage sensor timing and control circuit 1038 to system bus 1500,interface circuit 1102 for coupling electrical power input unit 1202 tosystem bus 1500, interface circuit 1106 for coupling illumination lightsource bank power input unit 1206 to system bus 1500, and interfacecircuit 1120 for coupling trigger 1220 to system bus 1500. Apparatus1000 can also include a display 1222 coupled to system bus 1500 and incommunication with CPU 1060, via interface 1122, as well as pointermechanism 1224 in communication with CPU 1060 via interface 1124connected to system bus 1500. Apparatus 1000 can also include rangedetector unit 1210 coupled to system bus 1500 via interface 1110. In oneembodiment, range detector unit 1210 can be an acoustic range detectorunit. Apparatus 1000 can also include a keyboard 1226 coupled to systembus 1500 via interface 1126. Various interface circuits of apparatus1000 can share circuit components. For example, a common microcontrollercan be established for providing control inputs to both image sensortiming and control circuit 1038 and to power input unit 1206. A commonmicrocontroller providing control inputs to circuit 1038 and to powerinput unit 1206 can be provided to coordinate timing between imagesensor array controls and illumination subsystem controls. Apparatus1000 may include a network communication interface 1252 coupled tosystem bus 1500 and in communication with CPU 1060, via interface 1152.Network communication interface 1252 may be configured to communicatewith an external computer through a network.

A succession of frames of image data that can be captured and subject tothe described processing can be full frames (including pixel valuescorresponding to each pixel of image sensor array 1033 or a maximumnumber of pixels read out from image sensor array 1033 during operationof apparatus 1000). A succession of frames of image data that can becaptured and subject to the described processing can also be “windowedframes” comprising pixel values corresponding to less than a full frameof pixels of image sensor array 1033. A succession of frames of imagedata that can be captured and subject to the described processing canalso comprise a combination of full frames and windowed frames. A fullframe can be read out for capture by selectively addressing pixels ofimage sensor 1032 having image sensor array 1033 corresponding to thefull frame. A windowed frame can be read out for capture by selectivelyaddressing pixels of image sensor 1032 having image sensor array 1033corresponding to the windowed frame. In one embodiment, a number ofpixels subject to addressing and read out determine a picture size of aframe. Accordingly, a full frame can be regarded as having a firstrelatively larger picture size and a windowed frame can be regarded ashaving a relatively smaller picture size relative to a picture size of afull frame. A picture size of a windowed frame can vary depending on thenumber of pixels subject to addressing and readout for capture of awindowed frame.

Apparatus 1000 can capture frames of image data at a rate known as aframe rate. A typical frame rate is 60 frames per second (FPS) whichtranslates to a frame time (frame period) of 16.6 ms. Another typicalframe rate is 30 frames per second (FPS) which translates to a frametime (frame period) of 33.3 ms per frame. A frame rate of apparatus 1000can be increased (and frame time decreased) by decreasing of a framepicture size.

Referring now to FIG. 4, at least one contact pad 404 may be disposed ona surface of circuit board 402, which may be a printed circuit board. Atleast one electrode pad 406 may be disposed on a surface of image sensorintegrated circuit 1040. At least one conductive projection 408 mayextend away from image sensor integrated circuit 1040. As shown in FIG.4, the at least one conductive projection 408, may be disposed upon theat least one electrode pad 406. At least one conductive adhesiveconnector 410 may be disposed between the at least one conductiveprojection 408 and at least one contact pad 404. In an alternativeembodiment, the at least one conductive adhesive connector 410 may bepositioned the at least one contact pad 404 and the at least oneelectrode pad 406. In at least one embodiment, the at least oneconductive adhesive connector 410 may be comprised of solder; however,alternative suitable materials may be used. A material such as a resinor organic material 412 may be placed over and/or around image sensorintegrated circuit 1040 to prevent damage and insure proper performance.

Still referring to FIG. 4, light source bank 500 may include one or morelight source. One or more of the one or more light sources of bank 500can be disposed on circuit board 402. In one embodiment, light sourcebank 500 may be comprised of a single light source 502. In still anotherembodiment a light source 502 or light source bank 500 may be comprisedof a single LED. Light source bank 500 may be comprised or more than onelight source 502, for example more than one LED. In addition, one ormore light source 602 of aiming subsystem 600 may be disposed on circuitboard 402. Aiming subsystem 600 may include a single aiming light source602, which in one embodiment can be provided by an LED. Aiming subsystem600 may include more than one light source, for example more than oneLED.

Referring now to FIG. 5, an alternative embodiment of an apparatus foruse in decoding a bar code symbol is shown. In the embodiment shown inFIG. 5, image sensor integrated circuit 1040 is connected to circuitboard 402 in generally the same manner as described above. Briefly, atleast one electrode pad 406, formed on integrated circuit 402 may haveat least one conductive projection 408 extending away from the imagesensor integrated circuit. At least one contact pad 404 may be formed oncircuit board 402, with at least one conductive adhesive connector 410formed between the at least one contact pad 404 and either the at leastone projection 408, at least one electrode pad 408, or both. A resin ororganic material 412 may be disposed on or around image sensorintegrated circuit 1040.

Still referring to FIG. 5, the apparatus for use in decoding a bar codesymbol may also include a light source bank 500 to provide illumination.Light source bank 500 may be comprised of a single light source 502,which may be provided by an LED. Alternatively, light source bank 500may include more than one light source 502, for example, more than oneLED. One or more light source 502 or light source bank 500 may bedisposed on the printed circuit board 402. One or more light source 502or light source bank 500 may be electrically and mechanically connectedto circuit board 402 in a manner similar to the connection of imagesensor integrated circuit 1040 discussed above. Particularly, at leastone electrode pad 406 may be disposed on light source bank 500, at leastone conductive projection 408 may extend away from the at least onecontact pad 404. At least one electrode pad may be formed on circuitboard 402, at least one conductive adhesive connector 410 may be formedbetween the at least one contact pad 404 and the at least one conductiveprojection 408 and/or the at least electrode pad 406.

Also shown in FIG. 5, aiming subsystem 600 may include a single aiminglight source 602, which may be provided by an LED. Alternatively, aimingsubsystem 600 may include more than one light source 602, for example,more than one LED. One or more aiming light source 602 of the aimingsubsystem 600 may be disposed on the circuit board 402 in a mannersimilar to light source 502 described above. At least one electrode pad406 may be disposed on aiming subsystem 600 and at least one conductiveprojection 408 may extend away from aiming subsystem 600. Circuit board402 may have at least one contact pad 404, where at least one conductiveadhesive connector 410 is disposed between the at least one contact pad404 and the at least one electrode pad 406 and/or at least oneconductive projection 408.

Still referring to FIG. 5, the circuitry described above for the imagesensor integrated circuit 1040, the light source bank 500, and theaiming subsystem 600, may be partially or wholly surrounded by a resinor organic material 412 to strengthen, protect, and/or secure theelectric and physical connection to the circuit board 402.

Referring to FIGS. 4 and 5, the elements as discussed above may bepartially or wholly disposed within a housing 1014, which in oneembodiment can be a hand held housing. In the embodiments describedabove the conductive adhesive connectors 410 may provide electricalinput/output and mechanical connections between the printed circuitboard 402 and the image sensor integrated circuit 1040, the light sourcebank 500 and/or the aimer subsystem 600. Also shown as shown in FIGS. 4and 5, lens assembly 200 may be disposed on image sensor integratedcircuit 1040. As shown in FIGS. 4 and 5, one or more light source 502 oflight source bank 500 may be positioned on the printed circuit board tominimize light waste. More specifically, one or more light source 502 oflight source bank 500 may extend approximately the same distance awayfrom the printed circuit board 402 as lens assembly 200. In alternativeembodiments, one or more light source 502 of the light source bank 500may extend further away from circuit board 400 than lens assembly 200.Apparatus 1000 can be adapted so that light produced by each of a one ormore light source of light source bank 500 may be utilized forprojection of an illumination pattern 1260 for illumination of a fieldof view 1240 (shown in FIG. 1) or in a manner sufficient for decodableindicia to be read. In a similar manner, one or more light source 602 ofaimer subsystem 600 may similarly be positioned on printed circuit board402 in order to minimize light waste. In one embodiment, aimer subsystem600 extends substantially the same distance away from the printedcircuit board 402 as lens assembly 200. However, in other embodimentsthe relative distance of the lens assembly 200 and aimer subsystem 600may be adjusted relative to one another to reach a suitableconfiguration.

Referring Now to FIG. 6, an example apparatus is shown 1000 is shown.Specifically, apparatus 1000 may have a housing 1014, which as shown inFIG. 6, may be a hand held housing. Housing 1014 is configured toencapsulate image sensor integrated circuit 1040 (shown in FIG. 4). Amicroprocessor integrated circuit 2060 having a CPU for attempting todecode decodable indicia can be disposed on circuit board 402 (shown inFIG. 4). Such microprocessor integrated circuit 2060 may be disposedexternally to circuit board 402, for example, on a circuit boardexternal to circuit board 402 within housing 1014. In anotherembodiment, apparatus 1000 may include CPU 1060, memory 1085, andnetwork communication interface 1252 comprising a first computer housedwithin housing 1014 (shown in FIG. 1), and a second computer 6000external to housing 1014, having a CPU 6010, memory 6020 and a networkcommunication interface 6030. Image data can be transmitted to thesecond computer 6000 for processing by the CPU 6010 for attempting todecode decodable indicia.

A small sample of systems methods and apparatus that are describedherein is as follows:

A1. An apparatus for use in decoding a bar code symbol, the apparatuscomprising:

an image sensor integrated circuit, the image sensor integrated circuithaving a plurality of pixels arranged in a plurality of rows and columnsof pixels, timing and control circuitry for controlling an image sensor,gain circuitry for controlling the gain of one or more signals, analogto digital conversion circuitry for conversion of an analog signal to adigital signal, and a plurality of electrode pads on a surface of theimage sensor integrated circuit;

a printed circuit board receiving the image sensor integrated circuit,the printed circuit board having a plurality of contact pads disposed ona surface of the printed circuit board; and

wherein a connection between said image sensor integrated circuit andsaid printed circuit board is characterized by a plurality of conductiveadhesive connectors disposed between the plurality of electrode pads onthe surface of the image sensor integrated circuit and the plurality ofcontact pads disposed on a surface of the printed circuit board, theconductive adhesive connectors providing electrical input/output andmechanical connections between said image sensor integrated circuit andsaid printed circuit board.

A2. The apparatus of A1, wherein the apparatus is operative forprocessing of image signals generated by the image sensor integratedcircuit for attempting to decode the bar code symbol.A3. The apparatus of A1, further comprising a hand held housingencapsulating the image sensor integrated circuit.A4. The apparatus of A3, wherein the processing of image signalsgenerated by the image sensor integrated circuit for attempting todecode the bar code symbol is performed within the housing.A5. The apparatus of A3, wherein the processing of image signalsgenerated by the image sensor integrated circuit for attempting todecode the bar code symbol is performed by circuitry external to thehousing.A6. The apparatus of A1, wherein the processing of image signalsgenerated by the image sensor integrated circuit for attempting todecode the bar code symbol is performed by a circuit disposed on saidprinted circuit board.A7. The apparatus of A1, wherein the processing of image signalsgenerated by the image sensor integrated circuit for attempting todecode the bar code symbol is performed by a computer external to thehousing.A8. The apparatus of A1 further comprising a light source bankpositioned on said printed circuit board.A9. The apparatus of A8 wherein the light source bank is an LED.A10. The apparatus of A1 further comprising a light source bank and alight circuitry for controlling the operation of the light source bank,the light source bank electrically connected to the light circuitry, andthe light circuitry electrically connected to said printed circuitboard.A11. The apparatus of A1 further comprising an aimer light source bankpositioned on said printed circuit board.A12. The apparatus of A11 wherein the aimer source bank is an LED.A13. The apparatus of A1 further comprising an aimer subsystem and anaimer light circuitry for controlling the operation of an aimer lightbank, the aimer light bank electrically connected to the aimer lightcircuitry, and the aimer light circuitry electrically connected to saidprinted circuit board.

While the present invention has been described with reference to anumber of specific embodiments, it will be understood that the truespirit and scope of the invention should be determined only with respectto claims that can be supported by the present specification. Further,while in numerous cases herein wherein systems and apparatuses andmethods are described as having a certain number of elements it will beunderstood that such systems, apparatuses and methods can be practicedwith fewer than or greater than the mentioned certain number ofelements. Also, while a number of particular embodiments have beendescribed, it will be understood that features and aspects that havebeen described with reference to each particular embodiment can be usedwith each remaining particularly described embodiment.

1. An apparatus, comprising: an image sensor integrated circuit, theimage sensor integrated circuit having an image sensor including aplurality of pixels arranged in a plurality of rows and columns ofpixels, timing and control circuitry for controlling the image sensor,gain circuitry for controlling the gain of one or more signals, analogto digital conversion circuitry for conversion of an analog signal to adigital signal, and a plurality of electrode pads on a surface of theimage sensor integrated circuit; a printed circuit board receiving theimage sensor integrated circuit, the printed circuit board having aplurality of contact pads disposed on a surface of the printed circuitboard; wherein a connection between said image sensor integrated circuitand said printed circuit board is characterized by a plurality ofconductive adhesive connectors disposed between the plurality ofelectrode pads on the surface of the image sensor integrated circuit andthe plurality of contact pads disposed on a surface of the printedcircuit board, the conductive adhesive connectors providing electricalinput/output and mechanical connections between said image sensorintegrated circuit and said printed circuit board; and a light sourcepositioned on said printed circuit board, the apparatus being adapted todirect light from the light source toward a field of view of theapparatus, wherein the light source is connected to the printed circuitboard by an adhesive conductive connector disposed between at least onecontact pad disposed on a surface of the printed circuit board and atleast one conductive projection extending away from an at least oneelectrode pad formed on the light source.
 2. The apparatus of claim 1,comprising a hand held housing encapsulating the image sensor integratedcircuit, wherein processing of image signals generated by the imagesensor integrated circuit for attempting to decode a symbol is performedwithin the housing.
 3. The apparatus of claim 1, wherein processing ofimage signals generated by the image sensor integrated circuit forattempting to decode a symbol is performed by a circuit disposed on theprinted circuit board.
 4. The apparatus of claim 1, comprising a handheld housing encapsulating the image sensor integrated circuit, whereinprocessing of image signals generated by the image sensor integratedcircuit for attempting to decode a symbol is performed by a computerexternal to the housing.
 5. The apparatus of claim 1, wherein the lightsource is a light source of an illuminating subsystem that projects anillumination pattern.
 6. An apparatus, comprising: an image sensorintegrated circuit comprising an image sensor and a plurality ofelectrode pads on a first surface of the image sensor integratedcircuit; a lens assembly disposed on a second surface of the imagesensor integrated circuit; a printed circuit board receiving the imagesensor integrated circuit, the printed circuit board having a pluralityof contact pads disposed on a surface of the printed circuit board; aplurality of conductive adhesive connectors disposed between theplurality of electrode pads on the first surface of the image sensorintegrated circuit and the plurality of contact pads disposed on thesurface of the printed circuit board; and a first light source of anillumination subsystem and a second light source of an aiming subsystempositioned on the printed circuit board, the apparatus being adapted todirect light from the first light source and the second light sourcetoward a field of view of the apparatus; wherein the first light sourceand the second light source are connected to the printed circuit boardby an adhesive conductive connector disposed between at least onecontact pad disposed on the surface of the printed circuit board and thefirst light source and the second light source; and wherein the firstlight source and the second light source extend away from the printedcircuit board by approximately the same distance which the lens assemblyextends from the printed circuit board or greater.
 7. The apparatus ofclaim 6, wherein the first light source and the second light source areprovided by LEDs.
 8. The apparatus of claim 6, comprising a circuitdisposed on the printed circuit board for processing image signalsgenerated by the image sensor integrated circuit for attempting todecode a symbol.
 9. The apparatus of claim 6, comprising a housingwherein processing of image signals generated by the image sensorintegrated circuit for attempting to decode a symbol is performed bycircuitry external to the housing.
 10. The apparatus of claim 6, whereinthe first light source projects an illumination pattern.
 11. Anapparatus, comprising: an image sensor integrated circuit comprising animage sensor and a plurality of electrode pads on a first surface of theimage sensor integrated circuit; a printed circuit board receiving theimage sensor integrated circuit, the printed circuit board having aplurality of contact pads disposed on a surface of the printed circuitboard; a plurality of conductive adhesive connectors disposed betweenthe plurality of electrode pads on the first surface of the image sensorintegrated circuit and the plurality of contact pads disposed on thesurface of the printed circuit board; and a first light source connectedto the printed circuit board by an adhesive conductive connectordisposed between a contact pad disposed on the surface of the printedcircuit board and the first light source.
 12. The apparatus of claim 11,comprising: a lens assembly disposed on a second surface of the imagesensor integrated circuit; wherein the first light source extends awayfrom the printed circuit board by approximately the same distance whichthe lens assembly extends from the printed circuit board or greater. 13.The apparatus of claim 11, comprising a hand held housing encapsulatingthe image sensor integrated circuit, wherein processing of image signalsgenerated by the image sensor integrated circuit for attempting todecode a symbol is performed within the housing.
 14. The apparatus ofclaim 11, comprising a hand held housing encapsulating the image sensorintegrated circuit, wherein processing of image signals generated by theimage sensor integrated circuit for attempting to decode a symbol isperformed by circuitry external to the housing.
 15. The apparatus ofclaim 11, wherein processing of image signals generated by the imagesensor integrated circuit for attempting to decode a symbol is performedby a circuit disposed on the printed circuit board.
 16. The apparatus ofclaim 11, comprising a hand held housing encapsulating the image sensorintegrated circuit, wherein processing of image signals generated by theimage sensor integrated circuit for attempting to decode a symbol isperformed by a computer external to the housing.
 17. The apparatus ofclaim 11, comprising a light circuitry for controlling the operation ofthe first light source, the first light source electrically connected tothe light circuitry, and the light circuitry disposed on the printedcircuit board.
 18. The apparatus of claim 11, wherein the first lightsource is a light source of an illuminating subsystem that projects anillumination pattern.
 19. The apparatus of claim 11, wherein the firstlight source is a light source of an aiming subsystem for use inprojecting an aiming pattern.
 20. The apparatus of claim 11, comprisingan aimer light source positioned on the printed circuit board.